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Features * * * * * * * Single 3-V Supply Voltage High Power-added Efficient Power Amplifier (Pout typically 26.5 dBm) Ramp-controlled Output Power Low-noise Preamplifier (NF typically 1.8 dB) Biasing for External PIN Diode T/R Switch Current-saving Standby Mode Few External Components DECT SiGe Front End IC U7004B Electrostatic sensitive device. Observe precautions for handling. Description The U7004B is a monolithic SiGe transmit/receive front end IC with power amplifier, 50-W internal matching, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like DECT. Due to the ramp-control feature and a very low quiescent current, an external switch transistor for VS is not required. Figure 1. Block Diagram VS_PA V1_PA PA PA_IN RAMP LNA LNA_IN TX/RX Standby control T/R Switch driver SWITCH_OUT V2_PA_OUT LNA_OUT RX_ON PU R_SWITCH 4713A-DECT-07/03 1 Pin Configuration Figure 2. Pinning SSO20 R_SWITCH SWITCH_OUT GND1 LNA_IN GND2 V1_PA GND3 GND4 GND5 1 2 3 4 20 19 18 17 PU RX_ON LNA_OUT GND8 VS_LNA PA_IN RAMP VS_PA GND7 GND6 U7004B 5 6 7 8 9 16 15 14 13 12 11 V2_PA_OUT 10 Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol R_SWITCH SWITCH_OUT GND1 LNA_IN GND2 V1_PA GND3 GND4 GND5 V2_PA_OUT GND6 GND7 VS_PA RAMP PA_IN VS_LNA GND8 LNA_OUT RX_ON PU Function Resistor to GND sets the PIN diode current Switched current output for PIN diode Ground Low-noise amplifier input Ground Inductor to power supply for power amplifier Ground Ground Ground Inductor to power supply and matching network for power amplifier output Ground Ground Supply voltage for power amplifier Power-ramping control input Power amplifier input Supply-voltage input for low-noise amplifier Ground Low-noise amplifier output RX active high Power-up active high 2 U7004B 4713A-DECT-07/03 U7004B Absolute Maximum Ratings All voltages refer to GND (pins 3, 5, 7, 8, 9, 11, 12 and 17), ESD protection according to ESD-S5.2-1994, Class M1. Parameters Supply voltage pins 6, 10, 13 and 16 (no RF) Duty cycle PA Burst duration PA Junction temperature Storage temperature Input power PA pin 15 Input power LNA pin 4 Tj Tstg PinPA PinLNA Symbol VS Value 5 50 5 150 -40 to +125 +10 -5 Unit V % ms C C dBm dBm Thermal Resistance Parameters Junction ambient Symbol RthJA Value 95 Unit K/W Operating Range All voltages refer to GND (Pins 3, 5, 7, 8, 9, 11, 12 and 17). The following table represents the sum of all supply currents depending on the TX/RX mode. Power supply points are VS_LNA, VS_PA, V1_PA, V2_PA_OUT. Parameters Supply voltage pins 6, 10 and 13 Supply voltage pin 16 Supply current TX RX Standby current PU = 0 Ambient temperature Symbol VS VS IS IS IS Tamb -25 Min. 2.7 2.7 Typ. 3.6 3.6 450 8 10 +25 +70 Max. 4.6 4.6 Unit V V mA mA A C Electrical Characteristics Test conditions (unless otherwise specified): VS = 3.6 V, Tamb = 25C, pulsed mode, duty cycle 4.17%, ton = 417 s Parameters Power Amplifier Supply voltage Supply current Supply current Standby current Frequency range Power gain Gain-control range Notes: (1) Test Conditions Pins 6, 10 and 13 TX RX (PA off) Standby TX TX, pin 15 to pin 10 TX Symbol VS IS_TX IS_RX IS_standby f Gp DGp Min. 2.7 Typ. 3.6 450 Max. 4.6 10 10 Unit V mA A A GHz dB dB 1.88 28 48 1.94 1. Power amplifier shall be unconditionally stable, maximum duty cycle 50%, maximum load mismatch and duration: load VSWR = 20:1 (all phases) 10 s, ZG = 50 W 2. With external matching network (see Figure 13 and Figure 14) 3. Low-noise amplifier shall be unconditionally stable 3 4713A-DECT-07/03 Electrical Characteristics (Continued) Test conditions (unless otherwise specified): VS = 3.6 V, Tamb = 25C, pulsed mode, duty cycle 4.17%, ton = 417 s Parameters Ramping voltage Ramping current Power-added efficiency Saturated output power Input matching (2) Output matching (2) Harmonics at P 1dB Maximum input power Stability (non harmonic emission) Test Conditions TX, power gain (max), pin 14 TX, power gain (max), pin 14 TX TX, refer to pin 10 TX, pin 15 TX, pin 10 TX, pin 10 Pin 15 TX, pin 10 Pin = 2 dBm, VRAMP = 2 V VSWRout < 10:1 (all phases) Standby, pin 2 RX TX at 100 W TX at 1.2 kW TX at 33 kW All, pin 16 RX TX (control logic active), pin 16 Standby, pin 16 RX RX, pin 4 to pin 18 RX RX, refer to pin 18 RX RX RX = 1, pins 19 and 20 =0 =1 =0 IS_O_standby IS_O_RX IS_O_100 IS_O_1k2 IS_O_33k VS IS IS IS f Gp NF P1dB IIP3 VSWRin VSWRin ViH ViL IiH IiL 2.4 0 40 0 1.88 17 19 1.8 -7 -15 < 2:1 < 2:1 VS 0.5 V V A A 2.0 2.7 1 3 10 3.6 8 300 1 10 1.94 4.6 Symbol VRAMP max IRAMP PAE Psat VSWRin VSWRout 2 fo 3 fo PinPA Min. Typ. 2.1 0.5 30 26.5 < 2:1 < 2:1 -30 10 -60 dBc dBm dBc 2.0 Max. Unit V mA % dBm T/R Switch Driver (Currently Programmed by External Resistor from R_SWITCH to GND) Switch-out current output Switch-out current output Switch-out current output Switch-out current output Switch-out current output Low-noise Amplifier Supply voltage Supply current Supply current (LNA and control logic) Standby current Frequency range Power gain Noise figure Gain compression 3rd-order input interception point Input matching Output matching Logic Input Levels (RX_ON, PU) High input level Low input level High input current Low input current Notes: (3) 2 2 A A mA mA mA V mA A A GHz dB dB dBm dBm 1. Power amplifier shall be unconditionally stable, maximum duty cycle 50%, maximum load mismatch and duration: load VSWR = 20:1 (all phases) 10 s, ZG = 50 W 2. With external matching network (see Figure 13 and Figure 14) 3. Low-noise amplifier shall be unconditionally stable 4 U7004B 4713A-DECT-07/03 U7004B Control Logic Table 1. Control Logic for LNA and T/R Switch Driver Operation Mode Standby TX RX PU 0 1 1 RX_ON 0 0 1 Figure 3. Output Power versus Ramp Voltage 30 20 Pout (dBM) 10 0 -10 -20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VRAMP (V) Input/Output Circuits Figure 4. Input Circuit PA_IN/VS_PA 13 VS_PA 15 PA_IN 17 GND1 5 4713A-DECT-07/03 Figure 5. Input Circuit RAMP/VS_PA 13 VS_PA 14 RAMP 7 GND7 Figure 6. Input Circuit V1_PA 6 V1_PA 8 GND3 Figure 7. Input/Output Circuit V2_PA 10 V2_PA_OUT 8 GND5 6 U7004B 4713A-DECT-07/03 U7004B Figure 8. Input Circuit LNA_IN/VS_LNA 16 VS_LNA 4 LNA_IN 3 GND1 Figure 9. Output Circuit LNA_OUT 16 VS_LNA 18 LNA_OUT 5 GND2 7 4713A-DECT-07/03 Figure 10. Input Circuit SWITCH_OUT/R_SWITCH 13 VS_PA 2 SWITCH_OUT 1 R_SWITCH 17 GND8 Figure 11. Input Circuit RX_ON 16 VS_LNA 19 RX_ON Figure 12. Input Circuit PU 16 VS_LNA 20 PU 8 U7004B 4713A-DECT-07/03 U7004B Typical Application Circuit Figure 13. Typical Schematic LNA_OUT PU RX_ON PCB 20 19 18 17 16 15 14 13 12 11 PA_IN RAMP TX/RX standby control TX U7004B LNA 1 2 3 4 5 6 7 8 9 PA 10 PCB diel. BPF PCB VS PCB Microstripline l/4 Antenna 9 4713A-DECT-07/03 Figure 14. U7004B Application Board Schematic Figure 15. U7004B Application Board Layout LNA_OUT PA_IN RAMP DECT Frontend 100 pF 0R 2.7 nH 2.7 pF 0R RX_ON 4.7 mF 0R 1.2 pF 1.0 pF 0R 0R 56 pF V1_PA 56pF 1nF 1mF 15nH 0R Components: - 3 Inductors (Pins 10,13,15) - 16 Capacitors - 1 Resistor (Pin 1) 0R V2_PA VS_PA GND 0R 2.7 k 390 0R 0R LNA_IN PA PA_OUT 10 U7004B 4713A-DECT-07/03 SWITCH_OUT 4.7 mF GND LNA 22nH 1 nF VS_LNA 0R 56 pF 56 pF PU 56pF U7004B Ordering Information Extended Type Number U7004B-MFS U7004B-MFSG3 Package SSO20 SSO20 Remarks Tube Taped and reeled Package Information Package SSO20 Dimensions in mm 6.75 6.50 5.7 5.3 4.5 4.3 1.30 0.25 0.65 5.85 20 11 0.15 0.05 0.15 6.6 6.3 technical drawings according to DIN specifications 1 10 11 4713A-DECT-07/03 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131 Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131 Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 literature@atmel.com Web Site http://www.atmel.com Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use as critical components in life support devices or systems. (c) Atmel Corporation 2003. All rights reserved. Atmel (R) and combinations thereof are the registered trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be the trademarks of others. Printed on recycled paper. 4713A-DECT-07/03 xM |
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